E8WSDC12-32.768K TR

E8WS Series REGULATORY COMPLIANCE 2011/65 + 2015/863 191 SVHC ITEM DESCRIPTION Watch Crystal Resonator 1.5mm x 3.2mm x 0.9mm 2 Pad Plastic Surface Mount (SMD) ELECTRICAL SPECIFICATIONS Frequency Equivalent Series Resistance (ESR) 32.768kHz 70 kOhms Max Shunt Capacitance (Co) Frequency Tolerance (at 25°C) Frequency Stability (over Temperature) Turn over Temperature 1.6pF Max ±20ppm (Tested at 0.1μW, See Options) Mode of Operation Load Capacitance Drive Level Aging (@25°C± 3°C) Operating Temperature Range Storage Temperature Range Insulation Resistance Revised K: 12/10/2020 -0.040ppm/(Change in °C)2 Max 25°C ±5°C Flexural Mode (Tuning Fork) 6pF, 7pF, 9pF, 12.5pF or Specify 0.1 µWatt Typical, 0.5µWatt Max ±2ppm/First Year Max -40°C to +85°C -55°C to +125°C 500 Mohms Minimum (at 100Vdc +/-15Vdc) Page 2 of 10 www.ecliptek.com E8WS Series PART NUMBERING GUIDE Revised K: 12/10/2020 Page 3 of 10 www.ecliptek.com E8WS Series MECHANICAL DIMENSIONS 0.7±0.1 PIN 1 2 CONNECTION Crystal Crystal Note: Due to material availability, the outline and finish color of the component may vary. This variation in no way affects the electrical performance of the product. SUGGESTED SOLDER PAD LAYOUT All Dimensions in Millimeters Revised K: 12/10/2020 Page 4 of 10 www.ecliptek.com E8WS Series TAPE & REEL DIMENSIONS Quantity per Reel: 3000 Units All Dimensions in Millimeters Compliant to EIA-481 Revised K: 12/10/2020 Page 5 of 10 www.ecliptek.com E8WS Series RECOMMENDED SOLDER REFLOW METHOD HIGH TEMPERATURE INFRARED/CONVECTION TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum(TS MAX) - Time (tS) 3°C/Second Maximum Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) 3°C/Second Maximum Peak Temperature (TP) 260°C Maximum for 10 Seconds Maximum Target Peak Temperature(TP Target) 250°C +0/-5°C Time within 5°C of actual peak (tp) 20 - 40 Seconds Ramp-down Rate 6°C/Second Maximum Time 25°C to Peak Temperature (t) 8 Minutes Maximum Moisture Sensitivity Level Level 1 Additional Notes Temperatures shown are applied to body of device. 150°C 175°C 200°C 60 - 180 Seconds 217°C 60 - 150 Seconds High Temperature Manual Soldering 260°C Maximum for 5 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.) Revised K: 12/10/2020 Page 6 of 10 www.ecliptek.com E8WS Series RECOMMENDED SOLDER REFLOW METHOD LOW TEMPERATURE INFRARED/CONVECTION TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (Ts MIN) - Temperature Typical (Ts TYP) - Temperature Maximum(Ts MAX) - Time (ts) 5°C/Second Maximum Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) 5°C/Second Maximum Peak Temperature (TP) 245°C Maximum Target Peak Temperature (TP Target) 245°C Maximum 2 Times / 230˚C Maximum 1 Time Time within 5°C of actual peak (tp) 10 Seconds Maximum 2 Times / 80 Seconds Maximum 1 Time Ramp-down Rate 5°C/Second Maximum Time 25°C to Peak Temperature (t) N/A Moisture Sensitivity Level Level 1 Additional Notes Temperatures shown are applied to body of device. N/A 150°C N/A 30 - 60 Seconds 150°C 200 Seconds Maximum Low Temperature Manual Soldering 185°C Maximum for 10 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.) Revised K: 12/10/2020 Page 7 of 10 www.ecliptek.com