E8WS Series
REGULATORY COMPLIANCE
2011/65 +
2015/863
191 SVHC
ITEM DESCRIPTION
Watch Crystal Resonator 1.5mm x 3.2mm x 0.9mm 2 Pad Plastic Surface Mount (SMD)
ELECTRICAL SPECIFICATIONS
Frequency
Equivalent Series Resistance (ESR)
32.768kHz
70 kOhms Max
Shunt Capacitance (Co)
Frequency Tolerance (at 25°C)
Frequency Stability
(over Temperature)
Turn over Temperature
1.6pF Max
±20ppm (Tested at 0.1μW, See Options)
Mode of Operation
Load Capacitance
Drive Level
Aging (@25°C± 3°C)
Operating Temperature Range
Storage Temperature Range
Insulation Resistance
Revised K: 12/10/2020
-0.040ppm/(Change in °C)2 Max
25°C ±5°C
Flexural Mode (Tuning Fork)
6pF, 7pF, 9pF, 12.5pF or Specify
0.1 µWatt Typical, 0.5µWatt Max
±2ppm/First Year Max
-40°C to +85°C
-55°C to +125°C
500 Mohms Minimum (at 100Vdc +/-15Vdc)
Page 2 of 10
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E8WS Series
PART NUMBERING GUIDE
Revised K: 12/10/2020
Page 3 of 10
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E8WS Series
MECHANICAL DIMENSIONS
0.7±0.1
PIN
1
2
CONNECTION
Crystal
Crystal
Note: Due to material availability, the outline and finish color of the component may vary. This variation in no way affects the electrical
performance of the product.
SUGGESTED SOLDER PAD LAYOUT
All Dimensions in Millimeters
Revised K: 12/10/2020
Page 4 of 10
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E8WS Series
TAPE & REEL DIMENSIONS
Quantity per Reel: 3000 Units
All Dimensions in Millimeters
Compliant to EIA-481
Revised K: 12/10/2020
Page 5 of 10
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E8WS Series
RECOMMENDED SOLDER REFLOW METHOD
HIGH TEMPERATURE INFRARED/CONVECTION
TS MAX to TL (Ramp-up Rate)
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum(TS MAX)
- Time (tS)
3°C/Second Maximum
Ramp-up Rate (TL to TP)
Time Maintained Above:
- Temperature (TL)
- Time (tL)
3°C/Second Maximum
Peak Temperature (TP)
260°C Maximum for 10 Seconds Maximum
Target Peak Temperature(TP Target)
250°C +0/-5°C
Time within 5°C of actual peak (tp)
20 - 40 Seconds
Ramp-down Rate
6°C/Second Maximum
Time 25°C to Peak Temperature (t)
8 Minutes Maximum
Moisture Sensitivity Level
Level 1
Additional Notes
Temperatures shown are applied to body of device.
150°C
175°C
200°C
60 - 180 Seconds
217°C
60 - 150 Seconds
High Temperature Manual Soldering
260°C Maximum for 5 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.)
Revised K: 12/10/2020
Page 6 of 10
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E8WS Series
RECOMMENDED SOLDER REFLOW METHOD
LOW TEMPERATURE INFRARED/CONVECTION
TS MAX to TL (Ramp-up Rate)
Preheat
- Temperature Minimum (Ts MIN)
- Temperature Typical (Ts TYP)
- Temperature Maximum(Ts MAX)
- Time (ts)
5°C/Second Maximum
Ramp-up Rate (TL to TP)
Time Maintained Above:
- Temperature (TL)
- Time (tL)
5°C/Second Maximum
Peak Temperature (TP)
245°C Maximum
Target Peak Temperature (TP Target)
245°C Maximum 2 Times / 230˚C Maximum 1 Time
Time within 5°C of actual peak (tp)
10 Seconds Maximum 2 Times / 80 Seconds Maximum 1 Time
Ramp-down Rate
5°C/Second Maximum
Time 25°C to Peak Temperature (t)
N/A
Moisture Sensitivity Level
Level 1
Additional Notes
Temperatures shown are applied to body of device.
N/A
150°C
N/A
30 - 60 Seconds
150°C
200 Seconds Maximum
Low Temperature Manual Soldering
185°C Maximum for 10 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.)
Revised K: 12/10/2020
Page 7 of 10
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E8WSDC12-32.768K TR 价格&库存
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免费人工找货- 国内价格
- 750+8.01658
- 1500+7.84371
- 国内价格
- 10+8.19569
- 750+8.01658
- 1500+7.84371